C'EsTBon LINGFE 30x30x11mm Pure Copper Heatsink Heat Sink Radiator Cooler Compatible for Electronic Chip MOS IC 3D Printer Cooling Joyous
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Product details
| Management number | 216219700 | Release Date | 2026/04/19 | List Price | US$14.39 | Model Number | 216219700 | ||
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Product DescriptionExteral Size: 30x30x11mm Material: Pure CopperProcessing method:Skiving finFinishing: Antioxidant treatmentBottom Thickness: 3mmCopper Fin thickness: 0.4mmPackage:1pc1.Used for Electronic,CHIP, Raspberry pi,MOS ,IC,computer 's component heat dissipation, or anywhere you need a efficient heatsink.2.This Heatsink is made of pure copper, and the thermal conductivity up to 401W/(mK.)3.This is high quality and effective heatsink that made pricise processing,smooth surface,no burr,we recommand you choose this.4.Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.Welcome to Lingfeng Storehappy shopping, happy shopping
- Exteral Size: 30x30x11mm
- Material: Pure Copper
- Processing method:Skiving fin
- Finishing: Antioxidant treatment
- Bottom Thickness: 3mm
| Brand Name | C'EsTBon |
|---|---|
| Unit Count | 1.0 Count |
| Item Weight | 1 Grams |
| Manufacturer | C'EsTBon |
| Cooler Heatsink Material | Copper |
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